Products Description
Thermal Compound Supplier - 1.93W/m-k HY510 30g Silicone
Quantity
FOB Price
≥5000
US$ 0.24
1000–4999
US$ 0.28
500–999
US$ 0.3
125–499
US$ 0.35
Product Attribute
CAS No.:
7085-85-0
Place of Origin:
Guangdong, China
Main Raw Material:
Silicone
Usage:
CPU,Graphics card
Brand Name:
OEM
Classification:
Other Adhesives
EINECS No.:
230-391-5
MF:
mixed
Other Names:
Silicone Sealant
Type:
silicone sealant
Thermal conductivity:
>1.93W/m-K
Thermal Impedance:
<0.225°C-in2/W
Gravity:
>2.0g/cm3
Thixotropic Index:
380±10 1/10mm
Operation Temperature(Peak):
-30~300°C
Moment Bore Temperature:
-50~300°C
Packaging and delivery
Selling Units:
Single item
Single package size:
20X10X1 cm
Single gross weight:
0.100 kg
More
Sample Policy:
Free samples are available
Thermal Compound Supplier - 1.93W/m-k HY510 30g Silicone
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