Heat Sink Compound Factory - HY510 30g Heat Sink Thermal

Quantity
FOB Price
≥2000
US$ 0.26
500–1999
US$ 0.3
125–499
US$ 0.35
Product Attribute
application:
CPU,Graphics card
type:
Conductive Heatsink Plaster
heatsink material:
Silicone
place of origin:
GUA
model number:
HY510 30g
brand name:
OEM
CAS No:
7085-85-0
Operation temperature::
-30--300 C
Operation Temperature(Peak)::
-30~300°C
EINECS No:
230-391-5
Thermal conductivity::
>1.93W/m-K
Gravity::
>2.0 g/cm3
Thermal Impedance::
<0.225°C-in2/W
Moment Bore Temperature::
-50~300°C
Packaging and delivery
Selling Units:
Single item
Single package size:
10X14.5X5.5 cm
Single gross weight:
0.100 kg
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Sample Policy: Free samples are available
Products Description

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Shenzhen Licheng Electronics Co., Ltd.

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