Products Description
Integrated Circuit - Manufacturer - BOE B802-1R QFN20 Package IC Chip
Quantity
FOB Price
≥100
US$ 6.4
10–99
US$ 7.6
≤9
US$ 8
Product Attribute
Brand Name:
Original
Model Number:
BOE
Mounting Type:
SOP DIP SOT QFP QFN BGA
Manufacturing Date Code:
2024
Place of Origin:
Taiwan, China, Japan
Product Completion Type:
BOE
Description:
BOE
Application:
BOE
Series:
BOE
Features:
BOE
Packaging and delivery
Selling Units:
Single item
Single package size:
15X10X5 cm
Single gross weight:
0.050 kg
More
Sample Policy:
Free samples are available
Integrated Circuit - Manufacturer - BOE B802-1R QFN20 Package IC Chip
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