Integrated Circuit - Manufacturer - BL01 BLO1 QFN Package IC Chip

Quantity
FOB Price
≥100
US$ 4
10–99
US$ 4.75
≤9
US$ 5
Product Attribute
Brand Name:
Original
Model Number:
BL01
Mounting Type:
SOP DIP SOT QFP QFN BGA
Manufacturing Date Code:
2024
Place of Origin:
Taiwan, China, Japan
Product Completion Type:
BL01
Description:
BL01
Application:
BL01
Series:
BL01
Features:
BL01
Packaging and delivery
Selling Units:
Single item
Single package size:
15X10X5 cm
Single gross weight:
0.050 kg
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Sample Policy: Free samples are available
Products Description

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Shenzhen Nengliang Technology Co., Ltd.

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